Megasonic cleans have been applied to remove defects such as particles and polymer/resist residues in silicon wafer fabrication of IC devices. However, with the shrink of device technology node, megasonic cleans are being challenged to maintain high cleaning efficiency promoted by streaming force of stable cavitation for the smaller particles without producing pattern collapse caused by violent implosions of transient cavities.
Archive for category: Technical Article
Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing
The continuously increasing integration of today’s most advanced solar cells requires increasingly tight process control of the cell fabrication. Although numerous studies have been performed to analyze the mechanisms and kinetics of these processes, little attention, if any, has been given to monitoring and controlling the chemical concentrations in the process baths.
Cost of Ownership Comparison of Single Wafer Processes for Stripping Copper Pillar Bump Photomasks
A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has gained momentum for advanced packaging applications. Resist thickness requirements are increasing to the 40-100 μm range as Cu pillars and micro-bumps are adopted, to accommodate the tighter pitches required in the newest multi-chip package designs. In order to form the pillars, the resist mask must be thicker than the height of the pillars to contain the entire bump structure.