Furnaces for Power IC Technology
Akrion Technologies’ complete product line of vertical, FLOURIS, furnaces for Power IC technology provide diffusion, oxidation, annealing & alloying capabilities for 200 mm substrate sizes. The FLOURIS vertical furnace offers advanced process control and safety features to meet today’s challenging requirements all supported on a modern, sustainable platform.
Power ICs control the conversion of electric power from one form to another. They are the intermediary between a Source (generates power) and a Load (consumes power). Power ICs serve as either a switch (MOSFET, IGBT & BJT) or a rectifier (diodes & thyristors) and can be manufactured from a variety of materials to include silicon, silicon carbide or gallium nitride with several promising compound semiconductor materials in the wings. Today, we all rely on Power ICs for everyday life essentials such as cellphone, tablet and laptop chargers to portable battery packs to hybrid vehicles. Applications are rapidly expanding in the energy (PV, Grid, Wind), transportation (Rail, Automotive, Ships), consumer markets. The increasing capabilities of Power ICs to handle higher voltages, currents and frequencies with reduced power loss is rapidly expanding adoption in multiple new fields.
FLOURIS 201 Anneal/Oxidation Vertical Furnace
The FLOURIS 201 Vertical Anneal/Oxidation Furnace provides medium and high temperature annealing or oxidation of 200 mm silicon wafers for advanced IC devices. Based upon Naura’s popular 300 mm THEORIS 302, the FLOURIS 201 provides 200 mm fabs with the same reliability and process control in the growth of silicon dioxide films for buffer dielectric, sacrificial oxide, and gate oxide layers in front-end of line processing.