PINNACLE® Carrierless Wet Station

PINNACLE® 200 Carrierless Wet Station

PINNACLE® 200 Carrierless Wet Station

System Overview
Designed for the most cutting-edge devices. The fully automated Pinnacle System with its carrierless design; utilizes the most advanced wafer handling and process control subsystems to ensure the optimum process results for manufacturers of digital integrated circuits.

PINNACLE® 300 Carrierless Wet Station

PINNACLE® 300 Carrierless Wet Station

Substrate Size:200 mm, 300 mm
Application Compounds:Si and others
Technology Markets:Digital IC & Analog IC
Batch Size:50 Wafers
Processes
  • Photoresist strip
  • Pre-diffusion clean
  • Nitride etch
  • FEOL reclaim
  • BEOL reclaim
Production Advantages
  • Superior particle and metals performance
  • Eliminates carrier-based defects—no shadowing or contact marks
  • Rack and pinion style robot with absolute motor rotation encoding for precise positioning
  • Single point facilities connection for water, nitrogen, and CDA
  • Multi-tank plenum and modular compact design
  • Real time tracking of chemicals, water, and gases
  • Wafer Transfer System provides clean and dirty path (Pinnacle 300)