Single Wafer for Digital IC Technology
As a consequence of the wafer handling, deposition, etch, & photolithography process steps, submicron particles and other contaminants deposit onto the wafers, both front-side and back-side, and need to be removed prior to critical deposition steps. Akrion Technologies’ SAQUA series 300mm single wafer cleaning tool offers Digital IC manufacturers a multi-chamber production tool with high cleaning selectivity and efficiency at the smallest particle size.
The Digital IC (integrated circuit) market, largely composed of the largest IC manufacturers of memory, microprocessor, logic and foundry companies, is recognized as one of the most technically challenging markets in microelectronics. Modeled by the traditional “Moore’s Law”, Digital IC manufacturers are constantly pushing the limits in reducing feature size to new limits by introducing new device structures, novel materials and new methods.
The SAQUA 300mm single-wafer cleaning system utilizes single wafer, precisely controlled spin-spray wet cleaning technology to remove a variety of copper post etch residue and byproducts or backside metal contamination.