Megasonic Agitation Allows Removal of Chemically Amplified Photoresists

Megasonic Agitation Allows Removal of Chemically Amplified Photoresists

Solvent chemicals are widely used in the removal of chemically amplified photo-resist in advanced packaging and being researched in the front end metal gate step. Internal data shows megasonic agitation can enhance polymer removal without complete dissolution for various solvent chemicals. Data has shown solvents and solvent mixtures show better selectivity with advanced material stacks over aqueous solution. It has been established that megasonic energy can enhance particle removal from semiconductor devices after a solvent strip is performed.