Using an Ozonated- DI-Water Technology for Photoresist Removal

Using an Ozonated- DI-Water Technology for Photoresist Removal

As the semiconductor industry shifts from 200- to 300-mm wafers, the use of ozonated deionized water (DIO 3) in surface cleaning processes is expected to become common. The technology, which has the potential to lower operating costs while maintaining process capabilities, has been widely studied, with particular emphasis on its application in photoresist removal after dry etching or ion implantation.