CO2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System

CO2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System

Megasonic cleans have been applied to remove defects such as particles and polymer/resist residues in silicon wafer fabrication of IC devices. However, with the shrink of device technology node, megasonic cleans are being challenged to maintain high cleaning efficiency promoted by streaming force of stable cavitation for the smaller particles without producing pattern collapse caused by violent implosions of transient cavities.