Technical Articles

Maintaining a Stable Etch Selectivity between Silicon Nitride and Silicon Dioxide in a Hot Phosphoric Acid Bath
Experiments showed that increasing water concentration in the bath results in higher selectivity: more Si3N4 etched and less SiO2 etched ...
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Cost of Ownership Comparison of Single Wafer Processes for Stripping Copper Pillar Bump Photomasks
A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has ...
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A New Approach to Tackle Wafer Contact Mark Contamination Issues in Marangoni Drying
Contact mark contamination of Si wafers in Marangoni drying is related to water retention at the contact area between wafers ...
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How to Overcome the Effects of Silicon Build-Up During Solar Cell Wet Chemical Processing
Although the chemical reaction is well known, the anisotropic etching of Si in alkaline solutions is a complex process. This ...
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Optimized Wet Processes and PECVD for High-Efficiency Solar Cells
In this study, we highlight the effect of pre-cleans, texturization and final cleans on cell parameters. We also studied the ...
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CO2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System
Megasonic cleans have been applied to remove defects such as particles and polymer/resist residues in silicon wafer fabrication of IC ...
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Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing
The continuously increasing integration of today’s most advanced solar cells requires increasingly tight process control of the cell fabrication. Although ...
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Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has ...
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Correlation Between Conductivity and pH Measurements for KOH Texturing Solutions and Additives
The ability to control the chemical concentration of etching baths is a critical step in being able to achieve uniform ...
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Process Control Challenges of Wet Etching Large MEMS Si Cavities
Anisotropic etching of silicon refers to the directional-dependent etching, usually by alkaline etchants like aqueous KOH, TMAH and other hydroxides ...
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Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing
Solar cell manufacturing requires many wet cleaning steps. Texturization is one of these steps. As a method for light trapping, ...
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Simultaneous Removal of Particles from Front and Back Sides by A Single Wafer Backside Megasonic System
In IC manufacturing, particle removal from a wafer's back side (BS) has become as important as that from the front ...
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