Technical Articles

Using an Ozonated- DI-Water Technology for Photoresist Removal
As the semiconductor industry shifts from 200- to 300-mm wafers, the use of ozonated deionized water (DIO 3) in surface ...
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Effect of Pre-Cleaning on Texturization of C-Si Wafers in a KOH/IPA Mixture
Experiments were performed to investigate the effect of pre- cleaning on surface texturization of mono-crystalline silicon in an KOH/IPA solution ...
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Characterization of C-Si Texturization In Wet Koh/IPA and Its Effect On Cell Efficiency
Wafer surface texturization has become a key process in solar cell manufacturing. This paper presents the experiments we conducted to ...
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Low Consumption Front End Of the Line Cleaning : LC-FEOL
This article presents the Low Consumption Front End Of the Line cleaning: LC-FEOL, which addresses technical constraints imposed by SOI ...
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The Application of DI-O3 Water on Wafer Surface Preparation
Due to the continuously decreasing scale of integrated circuits (IC) and the increasing requirement in cost-of- ownership (CoO) reduction, throughput ...
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The Use Of Ozonated HF Solutions For Polysilicon Stripping
Ozone-based HF chemistry is proposed to substitute the conventional HF/HNO3 mixture for polysilicon stripping in wafer reclamation. The etching characteristics ...
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Evaluation of Advanced Pre-Gate Cleanings
In order to meet stricter wafer cleanliness requirements, emerging environmental concerns and more stringent cost-effectiveness criteria, wafer cleaning technology is ...
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HF Concentration Control in IC Manufacturing
This paper demonstrates the use of conductivity sensors to monitor and control the concentration of HF etching solutions. Effects of ...
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Megasonic Agitation Allows Removal of Chemically Amplified Photoresists
Solvent chemicals are widely used in the removal of chemically amplified photo-resist in advanced packaging and being researched in the ...
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Extending Reticle Life Through Better Cleaning Budgets
Production fabs are constantly balancing the cost of manufacturing against yield. As device sizes shrink, there is an additional factor ...
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Development of IPA-Free Texturing Processes in Advanced Solar Cell Fabrication
Wafers processed in an IPA-free KOH bath with different extents of bath life and in baths with various silicate levels ...
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Application of In-situ Pre-epi Clean Process for Next Generation Semiconductor Devices
As electronic devices are evolving to more diversified and specifically function-oriented applications, silicon-based semiconductors have shown their limitation to unprecedented ...
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