Technical Articles

Effect of Pre-Cleaning on Texturization of C-Si Wafers in a KOH/IPA Mixture

Effect of Pre-Cleaning on Texturization of C-Si Wafers in a KOH/IPA Mixture

Experiments were performed to investigate the effect of pre- cleaning on surface texturization of mono-crystalline silicon in an KOH/IPA solution ...
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Characterization of C-Si Texturization In Wet Koh/IPA and Its Effect On Cell Efficiency

Characterization of C-Si Texturization In Wet Koh/IPA and Its Effect On Cell Efficiency

Wafer surface texturization has become a key process in solar cell manufacturing. This paper presents the experiments we conducted to ...
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Low Consumption Front End Of the Line Cleaning : LC-FEOL

Low Consumption Front End Of the Line Cleaning : LC-FEOL

This article presents the Low Consumption Front End Of the Line cleaning: LC-FEOL, which addresses technical constraints imposed by SOI ...
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The Application of DI-O3 Water on Wafer Surface Preparation

The Application of DI-O3 Water on Wafer Surface Preparation

Due to the continuously decreasing scale of integrated circuits (IC) and the increasing requirement in cost-of- ownership (CoO) reduction, throughput ...
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The Use Of Ozonated HF Solutions For Polysilicon Stripping

The Use Of Ozonated HF Solutions For Polysilicon Stripping

Ozone-based HF chemistry is proposed to substitute the conventional HF/HNO3 mixture for polysilicon stripping in wafer reclamation. The etching characteristics ...
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Evaluation of Advanced Pre-Gate Cleanings

Evaluation of Advanced Pre-Gate Cleanings

In order to meet stricter wafer cleanliness requirements, emerging environmental concerns and more stringent cost-effectiveness criteria, wafer cleaning technology is ...
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HF Concentration Control in IC Manufacturing

HF Concentration Control in IC Manufacturing

This paper demonstrates the use of conductivity sensors to monitor and control the concentration of HF etching solutions. Effects of ...
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Using an Ozonated- DI-Water Technology for Photoresist Removal

Using an Ozonated- DI-Water Technology for Photoresist Removal

As the semiconductor industry shifts from 200- to 300-mm wafers, the use of ozonated deionized water (DIO 3) in surface ...
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Megasonic Agitation Allows Removal of Chemically Amplified Photoresists

Megasonic Agitation Allows Removal of Chemically Amplified Photoresists

Solvent chemicals are widely used in the removal of chemically amplified photo-resist in advanced packaging and being researched in the ...
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Extending Reticle Life Through Better Cleaning Budgets

Extending Reticle Life Through Better Cleaning Budgets

Production fabs are constantly balancing the cost of manufacturing against yield.  As device sizes shrink, there is an additional factor ...
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Development of IPA-Free Texturing Processes in Advanced Solar Cell Fabrication

Development of IPA-Free Texturing Processes in Advanced Solar Cell Fabrication

Wafers processed in an IPA-free KOH bath with different extents of bath life and in baths with various silicate levels ...
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Advanced Chemical Concentration Control for Fabrication of Devices Using SiC

Advanced Chemical Concentration Control for Fabrication of Devices Using SiC

In conventional MEMS fabrication, relatively inert compounds such as Si3N4 are used as an etch stop or mask for creating ...
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AWP Wet Stations | bumping process | chemical concentration | chemical concentration control | chemically amplified photoresists | chemically amplified resists | cleaning | cleaning budgets | CO2-dissolved water | concentration control | conductivity | copper pillar bump | crystalline | deionized ozonated water | deposition | dissolved ozone | end of life | epitaxial | etch | etch selectivity | etching solutions | GAMA | HF | HF Concentration Control | IC Manufacturing | KOH Texturing | lithography | marangoni | marangoni drying | megasonic | megasonic agitation | megasonic clean | megasonics | MEMS | mono-crystalline silicon | oxidation and etching process | ozonated HF | ozonated water | particle removal | particle removal efficiency | pattern collapse | PECVD | pH Measurement | phosphoric acid | photomasks | photoresist | photoresist removal | photoresist stripping | polysilicon stripping | power IC | pre-cleaning | pre-cleans | pre-epi | pre-epi clean | pre-epitaxial | pre-gate cleaning | reticle life | reticles | SCP 9400 | SCP E200 | semiconductor | Si Cavities | Si content | SiC | silicon build up | silicon consumption | silicon dioxide | silicon etching | silicon nitride | single | single-wafer | solar | solar cell | solar cell efficiency | solar cell fabrication | solar cell manufacturing | Steag AWP | stripping | texturing process | texturization | uniformity | utilization | wafer cleaning | wafer contact mark | wafer surface preparation | wet batch immersion | wet chemical processing | wet cleans | wet etch | wet processing technology |