Technical Articles

Application of In-situ Pre-epi Clean Process for Next Generation Semiconductor Devices

Application of In-situ Pre-epi Clean Process for Next Generation Semiconductor Devices

As electronic devices are evolving to more diversified and specifically function-oriented applications, silicon-based semiconductors have shown their limitation to unprecedented ...
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Advanced Chemical Concentration Control for Fabrication of Devices Using SiC

Advanced Chemical Concentration Control for Fabrication of Devices Using SiC

In conventional MEMS fabrication, relatively inert compounds such as Si3N4 are used as an etch stop or mask for creating ...
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Cost of ownership comparison of single wafer processes for stripping copper pillar bump photomasks

Cost of ownership comparison of single wafer processes for stripping copper pillar bump photomasks

A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has ...
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