Our success was built on the design and production of customizable modular batch immersion solutions for clean and strip processes in the Analog IC, Digital IC, Power IC, MEMS, and R&D technologies.
Providing highly cost-effective dry etch, deposition and thermal wafer fab equipment solutions to semiconductor device fabs and substrate suppliers.
Delivering full technical support including installations, maintenance, advanced process assistance, training, parts repair and replacement, system upgrades, and emergency service with 24 hour phone support.
Akrion Technologies is a leading supplier of advanced wafer surface preparation solutions used in the fabrication of microelectronic devices. The customized equipment, software & process solutions we develop enable our customers to achieve their unique R&D/production targets on 150/200/300mm substrates, whether bare or patterned, for the precise removal of microcontaminants or bulk films.
Akrion Technologies now provides a full complement of CVD, Etch, Furnace and Off-line process tools, supported by knowledgeable local engineers, to help our customers reduce their manufacturing costs in mature process areas.
Company Name Change from NAURA Akrion Inc. to Akrion Technologies Inc.
We would like to inform you that our company business name has changed as follows:
Akrion Technologies Inc.
6330 Hedgewood Drive, Suite 150
Allentown, PA USA 18106
The new company name became effective as of May 17, 2022.
This change is done to refocus our resources and rebrand our products and services as part of our commitment to our customers. We assure you that this rebranding will not affect in any way our partnership and there is no structural or management change involved. However, effective May 17, 2022, we will be using the new name for all our official purposes.
Thank you for your business and we appreciate you updating your records accordingly.