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PINNACLE® 200 Carrierless Wet Station
PINNACLE® 200 Carrierless Wet Station
System Overview
Designed for the most cutting-edge devices. The fully automated Pinnacle System with its carrierless design; utilizes the most advanced wafer handling and process control subsystems to ensure the optimum process results for manufacturers of digital integrated circuits.
PINNACLE® 300 Carrierless Wet Station
Substrate Size:
Application Compounds:
Technology Markets:
Batch Size:
200 mm, 300 mm
Si and others
Digital IC & Analog IC
50 Wafers
Production Advantages
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Superior particle and metal performance
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Eliminates carrier-based defects—no shadowing or contact marks
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Rack and pinion style robot with absolute motor rotation encoding for precise positioning
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Single point facilities connection for water, nitrogen, and CDA
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Multi-tank plenum and modular compact design
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Real-time tracking of chemicals, water, and gases
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Wafer Transfer System provides clean and dirty path (Pinnacle 300)
Processes
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Photoresist strip
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Pre-diffusion clean
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Nitride etch
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FEOL reclaim
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BEOL reclaim
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